IC Targets
Omat IC targets include high-purity Cu, Al, Ti, Ta, Co sputtering targets for semiconductor chips, purity ≥99.99%, precise grain size control, widely used in advanced chip manufacturing.
应用领域：Semiconductor Chip Targets
产品列表
共 6 products
High-Purity Cu Target
High-purity copper sputtering target for IC interconnects, purity ≥99.99%, grain size ≤70μm
High-purity copper sputtering target for semiconductor chip interconnect layer,
High-Purity Al Target
High-purity aluminum sputtering target for IC, purity ≥99.999%, grain size ≤90μm
High-purity aluminum sputtering target for semiconductor chips, purity ≥99.999%,
Ti Target
Titanium sputtering target for semiconductor barrier layer
Titanium sputtering target for semiconductor barrier layer, high purity, high de
Ta Target
Tantalum sputtering target for Cu interconnect diffusion barrier
Tantalum sputtering target for semiconductor copper interconnect diffusion barri
Co Target
Cobalt sputtering target for semiconductor contact layer
Cobalt sputtering target for semiconductor contact layer, suitable for advanced
Phosphor Copper Anode
High-purity phosphor copper anode for IC plating
High-purity phosphor copper anode for IC electroplating, uniform phosphorus cont
